| Hybrid Circuit Fabrication & Attachment
- Hybrid Interconnect Substrates
- Standard thick film
- Etchable thick film (to 40 GHz)
- Standard thin film
- Co-fired - LTCC, HTCC
- Component Attach
- Standard chip and wire
- Component Handling
- Tape and reel
- Waffle pack
- Wafer
- Controlled Impedance Structures
- Microstrip
- Stripline
- Co-planar waveguide
- BGA (Ball Grid Array)
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