MRSI Model 505 Bare die pick & place (epoxies, solder paste) Pattern recognition placement (full 360 degrees) +/- 20 micron accuracy (3 sigma) 2000 components/hr throughput Conveyor fed interfaces Waffle pack and tape & reel compatible MYDATA Model MY-12 SMT pick & place (epoxies, solder paste) Pattern recognition placement: BGA QFP (including lead trim & straightening) +/- 15 micron accuracy (3 sigma) 20,500 components/hr throughput Waffle pack and tape & reel and stick compatible Delvotec Model 4500 Multichip epoxy diebonder (fully automatic) Bare die pick & place Pattern recognition placement 0.25 micron, 0.02 degrees resolution 2500 components/hr throughput Waffle Pack and Wafer compatible Delvotec Model 6200 Thermosonic gold ball bonder (fully automatic) Fine wire compatible (17.7 to 75 microns dia) Pattern recognition based x-y accuracy better than +/- 1.5 microns 3600 bonds/hr throughput Magazine to magazine in line conveyer compatible Delvotec Model 6400 Rotary head wedge bonder (fully automatic) Wire sizes 25 to 75 microns Wire feed angle 30 to 90 degrees x-y accuracy better than +/- 1.5 microns 2400 bonds/hr throughput Magazine to magazine in line conveyer compatible

MRSI 505 MY DATA Automation Delvotec 4500 Delvotec 6200 Delvotec 6400