Teledyne Microelectronic Technologies A Teledyne Technologies Company

Home    Company Info    Products & Services    Teledyne Companies


Technology
Capabilities
Tools

Products & Services
RF/Microwave
Optoelectronics
Space Microelectronics
Mixed Signal
Power
Secure Communications
Lighting & Displays

Standard Products
ALPHABEAM™ LED Light
Radiation Dosimeter
Fiber Optic Products

Company Info
About Us
Quality Assurance
Press Releases/News
Tradeshows
Environmental Policy
Supplier Information

Literature

Contact
Contact Us
Sales Representatives
Map & Directions
Search

Terms and Conditions
DVT Prototyping
 

  • The DVT Prototyping activity provides an "early warning" regarding
    • Functional performance margins
      • Basic performance
      • Performance over temperature
      • Performance over power supply regulation and ripple limits
    • Test requirements
      • In process
      • Final ATP
    • Yield expectations(scrap and rework)
    • All of the above influences the Design to Unit Production Cost (DTUPC) assessment

Protopype Die Attach & Wire Bonding (click to enlarge)
Prototype Die Attach
&
Wire Bonding





Home | ISO 9001 | Terms of Use | Careers | Search | Contact

Teledyne Microelectronics • 12964 Panama Street, Los Angeles, CA 90066
310.822.8229 • 800.518.1015 | microelectronics@teledyne.com
Copyright © 2010 Teledyne Technologies Incorporated. All rights reserved.